Repair shop leaks the 2019 iPhone logic board, hinting at big changes under the hood
With the iPhone X, Apple moved to stacked logic boards inside its handsets, and Samsung did the same with the Exynos version of the S9, for instance. These advanced SLP (Substrate-Like PCB) circuit boards would stack or package the chips tighter together, making their footprint much smaller, and leaving space for other things inside a phone, like, ahem, larger batteries.
In it, we can see that Apple will still follow the stacked dual-layer structure, but the component places have been rearranged, and the Apple A13 processor area on the board is more elongated than square, shrinking the board’s width, and paving the way for a new battery form and possible for the new, richer camera area on the back.
New 2019 iPhone vs iPhone XS logic board
